Electronic apparatus

ABSTRACT

According to one embodiment, an electronic apparatus includes a housing having electric insulation properties, and a circuit element installed in the housing and including a plurality of connection terminals, wherein the housing includes an inner surface including a mounting region on which the circuit element is mounted, a plurality of adhesive filled portions in the mounting region, which are separated by a division wall in order to correspond to the connection terminals of the circuit element, and through which the connection terminals are inserted, and a plurality of traces provided on the inner surface of the housing, one ends of the traces running through the adhesive filled portions, wherein the adhesive filled portions of the housing are filled with conductive adhesive which fix the circuit element to the mounting region, and wherein the connection terminals are electrically connected to the traces by the conductive adhesive.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2009-286679, filed Dec. 17, 2009; theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to an electronic apparatusthe inside of the housing of which has a signal line to which a circuitelement is fixed by a conductive adhesive.

BACKGROUND

An electronic apparatus, such as a portable computer or a cellularphone, comprises a connecter through which peripheral equipment isconnected. The connector is housed inside the electronic apparatus andis exposed through an opening in the periphery of the housing.

The apparatus also comprises a printed circuit board which has aconnector mounting region in which a plurality of pads are arranged. Theconnector comprises a plurality of connection terminals corresponding tothe pads, the connection terminals being soldered to the pads.

There is an increasing need to make the housing of a portable electronicapparatus, such as a portable computer, thinner. As a way of doing this,Jpn. Pat. Appln. KOKAI Publication No. 2005-268521, for example,discloses an electronic apparatus in which a conductive adhesive isprinted on the inside of the housing to form a circuit patternintegrated with the housing, and connection terminals are bonded to thelands of the pattern.

With this arrangement, the circuit pattern and a connector areelectrically connected by the conductive adhesive forming the circuitpattern, and the connector is fixed at a predetermined position on thehousing. This eliminates the need for a printed circuit board, savesspace and makes the housing thinner.

Jpn. Pat. Appln. KOKAI Publication No. 2005-268521 also discloses thatthe circuit pattern formed by the conductive adhesive takes the form ofthin lines. This structure makes it difficult to ensure a sufficientconnection area between the circuit pattern and the connection terminalsof a connector.

Thus, sufficient adhesive strength between the connector and housing maynot be achieved, impairing the soundness of the electrical andmechanical joining of the connector.

BRIEF DESCRIPTION OF THE DRAWINGS

A general architecture that implements the various feature of theembodiments will now be described with reference to the drawings. Thedrawings and the associated descriptions are provided to illustrate theembodiments and not to limit the scope of the invention.

FIG. 1 is an exemplary perspective view showing a portable computeraccording to the first embodiment.

FIG. 2 is an exemplary perspective view of the dismantled housing inwhich a plurality of traces and a plurality of adhesive filled portionsare comprised, and connector having a connection terminal according tothe first embodiment.

FIG. 3 is an exemplary cross sectional view of the housing in which theconnector is bonded to a connector mounting region by a conductiveadhesive according to the first embodiment.

FIG. 4 is an exemplary cross sectional view showing the positionalrelation between the housing in which the traces and adhesive filledportions are comprised and the connector according to the firstembodiment.

FIG. 5 is an exemplary cross sectional view of the housing in which thetraces and a printed circuit board are electrically connected by arubber connector according to the first embodiment.

FIG. 6 is an exemplary cross sectional view of the portable computershown in FIG. 5, taken along the line F6-F6.

FIG. 7 is an exemplary perspective view of the dismantled housing inwhich a plurality of traces and a plurality of adhesive filled portionsare comprised, and the connector having a connection terminal accordingto the second embodiment.

FIG. 8 is an exemplary cross sectional view of the housing in which thetraces and a printed circuit board are electrically connected by arubber connector according to the second embodiment.

DETAILED DESCRIPTION

Various embodiments will be described hereinafter with reference to theaccompanying drawings.

In general, according to one embodiment, an electronic apparatusincludes: a housing having electric insulation properties; and a circuitelement installed in the housing and including a plurality of connectionterminals, wherein the housing includes: an inner surface including amounting region on which the circuit element is mounted; a plurality ofadhesive filled portions in the mounting region, which are separated bya division wall in order to correspond to the connection terminals ofthe circuit element, and through which the connection terminals areinserted; and a plurality of traces provided on the inner surface of thehousing, one ends of the traces running through the adhesive filledportions, wherein the adhesive filled portions of the housing are filledwith conductive adhesive which fix the circuit element to the mountingregion, and wherein the connection terminals are electrically connectedto the traces by the conductive adhesive.

A description will now be given of the first embodiment, with referenceto FIGS. 1 to 7.

FIG. 1 is a perspective view showing a portable computer 1 which is anexample of the electronic device. The portable computer 1 includes acomputer main body 2 and a display module 3.

The computer main body 2 includes a housing 4 which is formed, forexample, of synthetic resin and has electric insulation properties. Thehousing 4 is shaped like a flat box including a bottom wall 4 a, anupper wall 4 b and sidewall 4 c. The upper wall 4 b of the housingsupports a keyboard 5. The sidewall 4 c extends from the side edges ofthe bottom wall 4 a. The sidewall 4 c of the housing 4 comprises arectangular opening 6.

As shown in FIG. 1, the display module 3 includes a display housing 7and a liquid crystal display panel 8 which is housed in the displayhousing 7. The display housing 7 is shaped like a flat box and is aboutthe same size as the computer main body 2. The liquid crystal displaypanel 8 comprises a screen 8 a which shows image information and textinformation. The screen 8 a is exposed from the front surface of thedisplay housing 7.

The display module 3 is supported at the rear edge of the computer mainbody 2 by a hinge not shown in the figures. The display module 3 ispivotable between a closed position where the display module 3 is laidparallel to the computer main body 2 to cover the keyboard 5 and an openposition where the display module 3 is raised relative to the computermain body 2 to expose the keyboard 5 and the screen 8 a.

As shown in FIGS. 1 and 2, a connector 10 which is an example of thecircuit element is arranged in the opening 6 of the sidewall 4 c. Theconnector 10 is to connect peripheral equipment such as an externalmonitor (not shown in the figures) to the portable computer 1. Theconnector 10 comprises a socket 11 through which a plug of peripheralequipment is connected and a plurality of connection terminals 12. Thesocket 11 is exposed through the opening 6 of the housing 4. Theconnection terminals 12 are arranged like a matrix on a flat bottomsurface 13 of the connector 10 and project from the bottom surface 13.The connector 10 is supported on an upper surface 14 of the bottom wall4 a of the housing 4. The upper surface 14 of the bottom wall 4 a is anexample of the inner surface of the housing. The upper surface 14 of thebottom wall 4 a includes a connector mounting region 15. The connectormounting region 15 is adjacent to the opening 6, and the connector 10 isfixed to the housing 4 in the connector mounting region 15.

As shown in FIG. 2 to FIG. 4, the connector mounting region 15 comprisesa plurality of adhesive filled portions 16. The adhesive filled portions16 are divided to form a lattice by a division wall 17 so as tocorrespond to the connection terminals 12. The division wall 17 takesthe form of a framework which extends upward from the upper surface 14of the bottom wall 4 a, and surrounds each adhesive filled portion 16.Each adhesive filled portion 16 is opened and larger than eachconnection terminal 12 of the connector 10.

The division wall 17 comprises a plurality of trace introductionportions 19. Each of the trace introduction portions 19 is shaped like aslit opened toward the adhesive filled portion 16. The upper surface 14of the bottom wall 4 a is exposed at the trace introduction portions 19.

As shown in FIG. 2, a plurality of traces 20 are provided on the uppersurface 14 of the bottom wall 4 a. The traces 20 are formed integrallywith the housing 4 by applying the conductive adhesive linearly on theupper surface 14 of the bottom wall 4 a. The traces 20 extend widthwaysparallel to each other and separate from each other. The conductiveadhesive is applied on the upper surface 14 of the bottom wall 4 a by ascreen printing method or a dispensing method, for example.

One of the ends of each trace 20 runs through the trace introductionportion 19 of the division wall 17 into the adhesive filled portion 16.As shown in FIG. 3, a land 21 is provided at the end of each trace 20.The lands 21 are placed on the adhesive filled portions 16, and thewidth of the lands 21 is greater than the width of the traces 20.

As shown in FIGS. 3 and 4, the connector 10 laid on the division wall17. The bottom surface 13 of the connector 10 covers the adhesive filledportions 16 from above so that the connection terminals 12 of theconnector 10 are inserted into the adhesive filled portions 16 and laidon the lands 21.

A conductive adhesive 23 is filled in each of the adhesive filledportions 16. The conductive adhesive 23 is hardened so as to integrallycover the connection terminals 12 and the lands 21. The conductiveadhesive 23 filled in the adjoined adhesive filled portions 16 is keptelectrically insulated by the division wall 17.

In this structure, the connector 10 is fixed to the connector mountingregion 15 of the housing 4 by the conductive adhesive 23 so that theconnection terminals 12 of the connector 10 are maintained electricallyconnected to the lands 21 of the traces 20.

As shown in FIG. 2, the ends of the traces 20 opposed to the lands 21are placed away from the connector mounting region 15, and arranged sideby side and separate from each other on the upper surface 14 of thebottom wall 4 a. As shown in FIGS. 2, 5 and 6, the ends of the traces 20opposed to the lands 21 are electrically connected to one end of aprinted circuit board 26 by a rubber connector 25. The one end of theprinted circuit board 26 is fixed to a pair of bosses 27 a and 27 bprojecting from the upper surface 14 of the bottom wall 4 a by screws28. A plurality of pads 29 are provided on the bottom at the one end ofthe printed circuit board 26. The pads 29 are arranged side by side andseparate from each other to correspond to the ends of the traces 20opposed to the lands 21.

The rubber connector 25 is provided between the bottom wall 4 a and theone end of the printed circuit board 26. The rubber connector 25comprises a connector body 31 which is formed of an elastic body of, forexample, silicone rubber, and a plurality of wires 32 which penetratethe connector body 31. The wires 32 are arranged separate from eachother and parallel to each other.

The connector body 31 of the rubber connector 25 is held by a pair ofconnector holders 33 a and 33 b projecting from the upper surface 14 ofthe bottom wall 4 a, and extends along the line in which the ends of thetraces 20 and the pads 29 are arranged.

The connector body 31 is compressed between the bottom wall 4 a and theone end of the printed circuit board 26. This brings the opposite endsof the wires 32 into contact with the ends of the traces 20 opposed tolands 21 and the pads 29, respectively, thereby establishing electricalconnections between the traces 20 and the pads 29 of the printed circuitboard 26 by the wires 32.

The connector 10 is fixed to the connector mounting region 15 of thehousing 4 as described below.

First, a suitable amount of a conductive adhesive 23 is filled in eachof the adhesive filled portions 16 in which the lands 21 of the traces20 are provided, for example, by a dispensing method. The connector 10is placed on the division wall 17 of the connector mounting region 15,and the connection terminals 12 of the connector 10 are inserted intothe adhesive filled portions 16 in which the conductive adhesive 23 isfilled. Then, the connection terminals 12 are brought into contact withthe lands 21 through the conductive adhesive 23, and the connectionterminals 12 and the lands 21 are covered with the conductive adhesive23.

Next, the conductive adhesive 23 is hardened by heating to roomtemperature or high temperature. By this step, the connector 10 is fixedto the connector mounting region 15, and the connection terminals 12 ofthe connector 10 are kept electrically connected to the lands 21 of thetraces 20.

According to the aforementioned first embodiment, the plurality ofadhesive filled portions 16 which are formed as a lattice are providedon the connector mounting region 15 of the housing 4, and eachconnection terminal 12 of the connector 10 is inserted into eachadhesive filled portion 16. The connection terminals 12 are fixed to thehousing 4 by the conductive adhesive 23 filled in the adhesive filledportions 16 and kept electrically connected to the lands 21 of thetraces 20.

Since the adhesive filled portions 16 are separated by the division wall17, the conductive adhesive 23 filled in the adjacent adhesive filledportions 16 is isolated from each other so as to prevent a shortcircuit. This structure ensures the sufficient amount of conductiveadhesive 23 filled in each adhesive filled portion 16. In addition, thecontact areas of the conductive adhesive 23 and the adhesive filledportions 16 and the contact areas of the conductive adhesive 23 and theconnection terminals 12 are increased, thereby improving the adhesivestrength between the connector 10 and the connector mounting region 15.

Therefore, the electrical connection between the connector 10 and thetraces 20 is ensured, and the connector 10 is firmly fixed to theconnector mounting region 15.

The connector 10 receives an external force which pries the connector 10when peripheral equipment is plugged in or out. However, theaforementioned structure securely fixes the connector 10 so as to resistthe external force. This prevents wobbling of the connector 10 whenperipheral equipment is plugged in or out, and peripheral equipment iseasily plugged in or out.

In addition, according to the aforementioned structure, the divisionwall 17 which separates the adhesive filled portions 16 as a lattice isintegrally formed on the bottom wall 4 a of the housing 4, and thedivision wall 17 functions as a rib which reinforces the connectormounting region 15. This improves stiffness of the bottom wall 4 a andprevents the bottom wall 4 a from bending, thereby improving adhesion ofthe connector 10.

In addition, the division wall 17 comprises a plurality of traceintroduction portions 19. With this structure, the conductive adhesiveis lineally applied from the adhesive filled portions 16 to the uppersurface 14 of the bottom wall 4 a, and the traces 20 are integrallyprovided on the upper surface 14 of the bottom wall 4 a by theconductive adhesive.

The present invention is not limited to the first embodiment, but may bemodified without departing from the spirit or scope of the generalinventive concept.

For example, FIGS. 7 and 8 show the second embodiment. The structures ofa portable computer 1 of the second embodiment are similar to thestructures described in the first embodiment except that a bottom wall 4a of a housing 4 in which traces 20 are provided is reinforced. Thefollowing descriptions will therefore focus mainly on how the secondembodiment differs from the first embodiment. The structural componentsor elements that are similar to those of the first embodiment will bedenoted by the same reference symbols, and a repetitive description ofsuch components or elements will be omitted.

As shown in FIG. 7, a pair of extensions 41 a and 41 b are formedintegrally with an upper surface 14 of the bottom wall 4 a of thehousing 4. The extensions 41 a and 41 b are raised relative to thebottom wall 4 a and arranged parallel to the traces 20. The extensions41 a and 41 b are arranged separate from each other and parallel to eachother. The extensions 41 a and 41 b connect connector holders 33 a and33 b to a sidewall 4 c of the housing 4. In this embodiment, the traces20 and adhesive filled portions 16 separated by a division wall 17 areprovided between the extensions 41 a and 41 b.

In this structure, the extensions 41 a and 41 b are formed integrally onthe bottom wall 4 a of the housing 4, and the traces 20 are providedbetween the extensions 41 a and 41 b. The extensions 41 a and 41 bfunctions as a rib to reinforce the region of the bottom wall 4 a inwhich the traces 20 are provided. This improves stiffness of the bottomwall 4 a and prevents the bottom wall 4 a from bending, therebypreventing the traces 20 provided on the bottom wall 4 a by a conductiveadhesive from being broken or damaged.

The extensions may be provided between the neighboring traces. In such acase, the extensions and the traces are alternately arranged on thebottom wall, and this further improves stiffness of the bottom wall andprotects each trace by the extensions.

In the first embodiment, the housing is formed of synthetic resin, butmay be formed of metal such as magnesium and aluminum. When the housingis formed of metal, the traces are isolated from the housing by formingthe traces on an insulating layer on the inner surface of the housing,for example.

In addition, the circuit element attached to the housing is not limitedto the connector, but may be an electronic element such as asemiconductor package, for example.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. An electronic apparatus comprising: a housing inwhich at least an inner surface has electric insulation properties; acircuit element installed in the housing and comprising a connectionterminal; a circuit board situated within the housing, wherein thehousing comprises: a mounting region which is provided on the innersurface and on which the circuit element is mounted, an adhesive filledportion provided in the mounting region, which is separated by adivision wall projecting from the inner surface of the housing at aposition corresponding to the connection terminal of the circuitelement, and through which the connection terminal is inserted, and atrace provided on the inner surface of the housing and configured toconnect the circuit element with the circuit board, a first end of thetrace running through the adhesive filled portion, wherein the circuitelement is fixed to the mounting region by a conductive adhesive filledin the adhesive filled portion, and the connection terminal iselectrically connected to the trace via the conductive adhesive.
 2. Theelectronic apparatus of claim 1, wherein the connection terminal of thecircuit element is covered with the conductive adhesive.
 3. Theelectronic apparatus of claim 1, wherein the division wall has arib-like shape.
 4. The electronic apparatus of claim 1, wherein thedivision wall comprises a trace introduction portion which opens towardthe adhesive filled portion, and the trace runs through the traceintroduction portion into the adhesive filled portion from the innersurface of the housing.
 5. An electronic apparatus comprising: a housingin which at least an inner surface has electric insulation properties;an element installed in the housing; and a circuit board situated withinthe housing, wherein the housing comprises: a plurality of adhesivefilled portions which is separated by a projection projecting from theinner surface of the housing in order to correspond to a plurality ofconnection terminals of the element, and through which the connectionterminals are inserted, and a plurality of traces provided on the innersurface of the housing and configured to connect the element with thecircuit board, the first ends of the traces running through the adhesivefilled portions, wherein the adhesive filled portions are filled with aconductive adhesive used for fixing the element to the housing, and theconnection terminals are electrically connected to the traces via theconductive adhesive.
 6. The electronic apparatus of claim 5, wherein theprojection has a rib-like shape.
 7. The electronic apparatus of claim 5,wherein the traces are made of the conductive adhesive.
 8. Theelectronic apparatus of claim 5, wherein the adhesive filled portionsare divided to form a lattice by the projection so as to correspond tothe connection terminals.
 9. The electronic apparatus of claim 5,wherein each adhesive filled portion is larger than each connectionterminal of the element.
 10. The electronic apparatus of claim 1,further comprising a connector provided on the inner surface of thehousing and configured to be connected to the board, wherein a secondend of the trace is connected to the connector.
 11. The electronicapparatus of claim 5, further comprising a connector provided on theinner surface of the housing and configured to be connected to theboard, wherein second ends of the traces are connected to the connector.12. The electronic apparatus of claim 1, wherein the circuit elementcovers the adhesive filled portion.
 13. The electronic apparatus ofclaim 5, wherein the element covers the adhesive filled portion.